| PART |
Description |
Maker |
| P0300SL P0640SL P0900SL P1100SL P1300SL P1500SL P1 |
SIDACtor㈢ Device
SIDACtor? Device
SIDACtor庐 Device
SIDACtor垄莽 Device
|
Littelfuse
|
| 35150-0290 35150-0293 35182-0190 |
1.8 TERM POSITION ASS LOC 351500290 INTERCONNECTION DEVICE
TERMINAL ASSURANCE LOCK YEL INTERCONNECTION DEVICE
.070 TPA 1.80 POWER CONN 351820190 INTERCONNECTION DEVICE
|
Molex, Inc.
|
| LNP128012 |
Opto-Electronic Device - Unit Device - Panel Display Units
|
Panasonic
|
| HCFL/56 R6764-21 R6764-24 R6785-21 |
V.90/K56flex PC Card Device Sets for Host-Controlled, Low Power Applications
V90/K56 flex PC card device set
|
Conexant
|
| PALC22V10D-15JC PALC22V10D-15JI PALC22V10D-25DMB P |
From old datasheet system
Flash Erasable, Reprogrammable CMOS PAL㈢ Device
Flash Erasable, Reprogrammable CMOS PAL垄莽 Device
Flash Erasable, Reprogrammable CMOS PAL庐 Device
Flash Erasable, Reprogrammable CMOS PAL? Device
|
Cypress Semiconductor
|
| MC9S12DJ64MFU MC9S12DJ64VFU 9S12D32DGV1 S12BDLCV1D |
MC9S12DJ64 Device User Guide V01.17 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP80
9S12DGDJ64DGV1 Device Guide. also covers 9S12D64. 9S12A64. 9S12D32. and 9S12A32 devices 9S12DGDJ64DGV1设备指南。也包括9S12D649S12A649S12D32。和9S12A32设备
|
Motorola Mobility Holdings, Inc.
HIROSE ELECTRIC Co., Ltd.
Freescale Semiconductor, Inc
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| EPC2LI20 EPC1441PI8 EPC2 EPC8 |
Configuration Devices For SRAM-based Lut Devices, 440,800 1-bit Device With 5.0-V or 3.3-V Operation
Configuration Device Family
|
Altera Corporation
|
| U74LVC2G86L-S08-T U74LVC2G86L-S08-R U74LVC2G86G-S0 |
This device has power-down protective circuit, preventing device destruction when it is powered down.
Glass passivated triacs in a full pack plastic envelope, intended for use in applications requiring high bidirectional transient and blocking voltage capability and high thermal cycling performance.
|
Unisonic Technologies
|
| SII3811PB |
SteelVine?/a> Device Bridge
SteelVine⑩ Device Bridge
|
Silicon image
|
| ALD1108E ALD1108EDC ALD1108EPC ALD1108ESC ALD1110E |
QUAD/DUAL EPADPRECISION MATCHED PAIR N-CHANNEL MOSFET ARRAY
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD⑩)
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD)
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD?
QUAD/DUAL ELECTRICALLY PROGRAMMABLE ANALOG DEVICE (EPAD 双电可编程模拟器件（EPAD⑩）
|
ALD[Advanced Linear Devices]
Advanced Linear Devices, Inc.
|
| MCRF355 MCRF360 |
The MCRF355 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features optimized at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran
The MCRF360 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features operating at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran
|
Microchip
|
